TUNGSTEN COPPER COMPOSITE (WCu)
Product Brief IntroductionW-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:
Product Brief IntroductionW-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:
- Ceramic materials: , (A-90,A-95,A-99), BeO (B-95, B-99), AIN, etc;Semiconductor materials: Si, GaAs, SiGe, SiC, GaP;Metal Material: Kovar alloy(4J29), 42 alloy;
Material | Wt% Tungsten Content | Wt% Copper Content | g/ Density at 20ºC | W/M.K Thermal conductivity at 25ºC | (10-6/k) Coefficient of thermal expansion at 20ºC |
W90Cu10 | 901 | Balance | 17.0 | 180-190 | 6.5 |
W85Cu15 | 851 | Balance | 16.4 | 190-200 | 7.0 |
W80Cu20 | 801 | Balance | 15.6 | 200-210 | 8.3 |
W75Cu25 | 751 | Balance | 14.9 | 220-230 | 9.0 |
W50Cu50 | 501 | Balance | 12.2 | 310-340 | 12.5 |